网络配件

NVIDIA Jetson T5000 128GB Production Module

P/N:900-13834-0080-001 SKU: 900-13834-0080-001品牌: NVIDIA
类型
Jetson T5000 production system-on-module; Jetson Thor family

下单前确认

  • 确认准确的 SKU、料号、规格选项与数量。
  • 确认主机平台、端口、电气接口与固件兼容要求。
  • 付款前确认库存、交期、目的地与适用售后条款。
产品描述
The NVIDIA Jetson T5000, part number 900-13834-0080-001, brings Blackwell GPU acceleration and 128 GB of LPDDR5X memory to an integrated edge-computing design. Its 14-core Arm CPU and high-bandwidth sensor interfaces make it a candidate for demanding robotic perception, multimodal reasoning and concurrent AI pipelines. This is a production module for carrier-board integration. Select power, cooling, storage and software around the intended application, and validate latency with representative inputs before treating the published sparse FP4 compute figure as a system-performance target.
规格参数
CPU14-core 64-bit Arm Neoverse V3AE
GPUNVIDIA Blackwell; 2,560 CUDA cores; fifth-generation Tensor Cores
内存128 GB, 256-bit LPDDR5X
CPU cache1 MB L2 per core; 16 MB shared system L3
AI computeUp to 2,070 sparse FP4 TFLOPS, NVIDIA-reported at 130 W
料号900-13834-0080-001
Product typeJetson T5000 production system-on-module; Jetson Thor family
Storage supportExternal NVMe via PCIe; external SSD via USB 3.2
Memory bandwidth273 GB/s
Module connector699-pin board-to-board connector
Module dimensions100 × 87 mm
Thermal interfaceIntegrated thermal transfer plate (TTP) with heatpipe; system cooling must be engineered
Multi-Instance GPUMIG-capable GPU with 10 texture processing clusters (TPCs)
Vision accelerator1 × PVA v3
Maximum CPU frequency2.6 GHz
Maximum GPU frequency1.57 GHz
Networking capability4 × 25 GbE
Manufacturer lifecycleAvailable through August 2035
Production integrationRequires a compatible carrier, suitable power and cooling, storage and flashed software
Manufacturer part number900-13834-0080-001
Module power configuration40–130 W

产品问答

Is 900-13834-0080-001 a complete Jetson AGX Thor Developer Kit?

It identifies the Jetson T5000 production module. A complete deployed system also needs a carrier, cooling, power, storage and a software image. Do not assume the developer kit’s enclosure, fan, power supply or 1 TB drive is part of this module SKU.

How should I interpret the T5000 figure of 2,070 TFLOPS?

NVIDIA reports up to 2,070 sparse FP4 TFLOPS and labels the headline as measured at 130 W. Precision, sparsity and test conditions matter. It is not a frame-rate or tokens-per-second commitment, and it cannot be divided directly by Orin NX sparse INT8 TOPS to predict a workload speedup.

Will T5000 plug into an existing AGX Orin or Orin NX carrier?

The T5000 uses a 100 × 87 mm footprint and a 699-pin board-to-board connector. NVIDIA lists Thor and AGX Orin as form-factor compatible, without declaring them pin-compatible. Orin NX has a different 260-pin format. Review the carrier design and bring-up documentation before planning a migration.

Does its 128 GB memory include operating-system storage?

The 128 GB specification describes LPDDR5X system memory. The module supports external NVMe or USB SSD storage. The developer kit’s advertised 1 TB NVMe capacity must not be treated as a drive included with this production-module part number.

Can a small passive heatsink support every T5000 mode?

Cooling must be sized for the selected workload, power mode, enclosure and ambient conditions. The published module range reaches 130 W, and the integrated TTP is a thermal interface rather than evidence that any particular heatsink is sufficient. Validate sustained clocks and temperature in the finished system.

Does the 4 × 25 GbE specification mean the module has four network sockets?

It describes module-level networking capability. External connectors, physical routing and supported sensor paths come from the carrier and system design. Check the carrier, software support and sensor interfaces together before specifying a camera or high-rate data-ingest configuration.

可以先描述需求,型号、主机或数量尚未确定也能咨询。